| 专利名称： | CERAMIC LED PACKAGE |
| 公开（告）号： | |
| 公开（公告）日： | 2008-07-31 00:00:00 |
| 申请（专利）号： | US2008179618 |
| 申请日： | 2007-01-26 00:00:00 |
| 发明（设计）人： | |
| (申请)专利权（人）： | CHENG CHING-TAI (TW) |
| 内容： | Light-emitting diode (LED) packages with improved heat transfer paths for LED dies encased therein when compared to conventional LED packages are provided. For some embodiments, the LED package includes a ceramic substrate having a top cavity with one or more LED dies disposed within and having a bottom cavity for receiving a metallic insert to dissipate heat away from the LED dies. For other embodiments, an LED package is provided that includes a ceramic substrate having a heat spreader coupled to thermal vias filled with a highly thermally conductive composite. |
发布日期：2008-11-14 10:14:00