| 专利名称： | METHOD OF MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT |
| 公开（告）号： | |
| 公开（公告）日： | 2007-01-18 00:00:00 |
| 申请（专利）号： | JP2005187694(JP2007012654) |
| 申请日： | 2005-06-28 00:00:00 |
| 发明（设计）人： | SANYO ELECTRIC CO LTD |
| (申请)专利权（人）： | TANAKA YOSHINOBU ; HOSOKAWA JUNJI |
| 内容： | To provide a method of manufacturing a laminated ceramic electronic component capable of preventing the occurrence of a short-circuiting fail without increasing the size of the laminated ceramic electronic component. ! The method of manufacturing the laminated ceramic electronic component has a conductor pattern formation process. In the conductor pattern formation process: a vertical line 25b is formed in the cut-off region of a second green sheet 32 sandwiched between first and second conductor patterns 21, 22 that should be insulated mutually; a third conductor patten 23, which connects the vertical line 25b to the first conductor pattern 21 mutually, is formed on the surface of the second green sheet 32; and a fourth conductor pattern 24, where the vertical line 25b should be connected to the second conductor pattern 22 mutually, is formed on the surface of a third green sheet 33. In a cut-off process thereafter, third and fourth conductor patterns 23, 24 are cut, or the vertical line 25b is removed completely, thus insulating the first and second patterns 21, 22 each other. ! (C)2007,JPO&INPIT |
发布日期：2007-08-21 10:19:00