| 专利名称： | CERAMIC CIRCUIT BOARD ASSEMBLY |
| 公开（告）号： | |
| 公开（公告）日： | 2007-01-25 00:00:00 |
| 申请（专利）号： | JP2005197017(JP2007019126) |
| 申请日： | 2005-07-06 00:00:00 |
| 发明（设计）人： | SUMITOMO METAL ELECTRONICS DEVICES INC |
| (申请)专利权（人）： | MATSUDA YOICHI ; KUMOI TAKESHI |
| 内容： | To provide a ceramic circuit board assembly having division lines which allow the ceramic circuit board assembly to be easily divided into individual ceramic circuit boards with a high yield. ! The ceramic circuit board assembly 10 consists of a plurality of ceramic circuit boards 14, each of which is such that a circuit metal plate 12 is joined to one side of a ceramic substrate 11, and a heat dissipation metal plate 13 is joined to the other side, and a dummy portion 15 wherein a first dummy metal plate 16 is joined to an outer periphery of one principal plane and a second dummy metal plate 17 is joined to the other principal plane. On either side of the ceramic substrate 11, the division lines 18 are formed lengthwise and crosswise so as to cross at right angles with each other. Each division line is extended to the end of the ceramic substrate 11. The circuit metal plate 14, the first dummy metal plate 16, the heat dissipation metal plate 13, and the second dummy metal plate 17, are so formed that they may not be connected to any of the front or rear face of the ceramic substrate 11 where the division lines 18 will be formed. ! (C)2007,JPO&INPIT |
发布日期：2007-08-21 10:37:00