| 专利名称： | Wiring board and ceramic chip to be embedded |
| 公开（告）号： | |
| 公开（公告）日： | 2007-03-01 00:00:00 |
| 申请（专利）号： | US20060508968(US2007045814) |
| 申请日： | 2006-08-24 00:00:00 |
| 发明（设计）人： | |
| (申请)专利权（人）： | YAMAMOTO HIROSHI (JP);SEKI TOSHITAKE (JP) |
| 内容： | A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom. |
发布日期：2007-08-23 15:54:00