首页>>国外专利>>Electroconductive paste and ceramic electronic component including electroconductive paste
| 专利名称： | Electroconductive paste and ceramic electronic component including electroconductive paste |
| 公开（告）号： | |
| 公开（公告）日： | 2007-03-15 00:00:00 |
| 申请（专利）号： | US20060599461(US2007057237) |
| 申请日： | 2006-11-15 00:00:00 |
| 发明（设计）人： | MURATA MANUFACTURING CO |
| (申请)专利权（人）： | OHTANI AKIRA (JP);UKUMA YUJI (JP) |
| 内容： | For mounting on a substrate by using an electroconductive adhesive, an electroconductive paste for forming an external electrode which has improved moisture resistance and which is resistant to occurrence of external-electrode peeling, as well as a ceramic electronic component including the electroconductive paste are provided. The electroconductive paste includes a base-metal electroconductive powder, first glass frit, and an organic vehicle, wherein the first glass frit has a B2O3 content of 10 to 20 percent by mole, a SiO2 content of 50 to 65 percent by mole, an alkali metal oxide content of 10 to 20 percent by mole, a ZnO content of 1 to 5 percent by mole, a TiO2 content of 1 to 5 percent by mole, a ZrO2 content of 1 to 5 percent by mole, and an Al2O3 content of 1 to 5 percent by mole. |
发布日期：2007-08-23 15:03:00