| 专利名称： | Ceramic capacitor |
| 公开（告）号： | |
| 公开（公告）日： | 2007-03-22 00:00:00 |
| 申请（专利）号： | US20060513039(US2007064375) |
| 申请日： | 2006-08-31 00:00:00 |
| 发明（设计）人： | NGK SPARK PLUG CO |
| (申请)专利权（人）： | URASHIMA KAZUHIRO (JP);YURI SHINJI (JP) |
| 内容： | A circuit board ( 10, 10'', 10 ''') comprising: a board core ( 11 ) having a main core surface ( 12 ) and a rear core surface ( 13 ); a ceramic capacitor ( 101, 101', 101'', 101''', 101'''', 101''''', 101 '''''') having a main capacitor surface ( 102 ) and a rear capacitor surface ( 103 ), having a structure in which a first inner electrode layer ( 141 ) and a second inner electrode layer ( 142 ) are alternately stacked with a ceramic dielectric layer ( 105 ) interposed therebetween, and having a plurality of capacitor function units ( 107, 108 ) being electrically independent from each other, the ceramic capacitor ( 101, 101', 101'', 101''', 101'''', 101''''', 101 '''''') being buried in the board core ( 11 ) in a state where the main core surface ( 12 ) and the main capacitor surface ( 102 ) are directed in a same direction; and a buildup layer ( 31 ) having a structure in which an interlayer insulating layer ( 33, 35 ) and a conductor layer ( 42 ) are alternately stacked on the main core surface ( 12 ) and the main capacitor surface ( 102 ) and having a semiconductor integrated circuit device mounting region ( 23, 51, 52 ) for mounting a semiconductor integrated circuit device ( 21, 53, 54 ) having a plurality of processor cores ( 24, 25 ) on a surface ( 39 ) of the buildup layer ( 31 ), wherein the plurality of capacitor function units ( 107, 108 ) are capable of being electrically connected to the plurality of processor cores ( 24, 25 ), respectively. |
发布日期：2007-08-23 16:31:00