| 专利名称： | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-07 00:00:00 |
| 申请（专利）号： | JP2005153896 (JP2006332330 ) |
| 申请日： | 2005-05-26 00:00:00 |
| 发明（设计）人： | MURATA MFG CO LTD |
| (申请)专利权（人）： | FUKUTOME HIDETAKA ; TANIGUCHI MASAAKI |
| 内容： | To provide a manufacturing method of a laminated ceramic electronic component capable of making diameters approximately equal at both longitudinal ends of a through-hole when forming the through-hole for filling conductive paste to serve as a through-conductor, and further shaping the through-hole to be symmetric with respect to its longitudinal center, and to provide the laminated ceramic electronic component. ! In forming the through-hole 38 on a raw laminate 34, the method is employed which includes steps of forming part 38a of the through-hole after irradiating laser light 39 from the first principal plane 36 of the laminate 34 to form part 38a of the through-hole and thereafter irradiating laser light 40 from a second principal plane 37 to form the remaining through-hole 38b. Thus, the diameters at both ends of the through-hole 38 are made approximately equal. ! (C)2007,JPO&INPIT |
发布日期：2007-07-13 11:47:00