| 专利名称： | PROCESS AND APPARATUS OF MANUFACTURING CERAMIC ELECTRONIC PART |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-07 00:00:00 |
| 申请（专利）号： | JP2006123016（JP2006332635） |
| 申请日： | 2006-04-27 00:00:00 |
| 发明（设计）人： | MURATA MFG CO LTD |
| (申请)专利权（人）： | HIRANO HIROYUKI |
| 内容： | To provide a process of manufacturing a ceramic electronic part having a process which can cut a ceramic green block with high precision in the case of cutting the ceramic green block and in which a cutting fault cannot take place easily. ! The process of manufacturing the ceramic electronic part includes the steps of placing the ceramic green block 1 on a cutting table 12, arranging a stripper 15 separately at a clearance B smaller than the thickness of the ceramic green block and the top face of the ceramic green block 1 and the thickness of the ceramic green block, descending the cutting edge 16 so that the ceramic green block 1 may be cut from the top face side of the ceramic green block 1 while the position of the stripper 15 has fixed, cutting the ceramic green block 1, raising the cutting edge 16 after the cutting, making contact to this contact truncation strip on the lower surface of the stripper 15, and separating the cutting strip into it from the cutting edge 16 when the cutting strip of the ceramic green sheet block 1 is adhered to the cutting edge 16. ! (C)2007,JPO&INPIT |
发布日期：2007-07-19 08:20:00