| 专利名称： | METAL-CERAMIC COMPOUND SUBSTRATE AND MANUFACTURING METHOD OF THE SAME |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-14 00:00:00 |
| 申请（专利）号： | JP2005166162（JP2006339611 ） |
| 申请日： | 2005-06-06 00:00:00 |
| 发明（设计）人： | DOWA HOLDINGS CO LTD |
| (申请)专利权（人）： | OSHIKA YOSHIKAZU |
| 内容： | To provide a metal-ceramic compound substrate having favorable heat dissipation properties, manufactured at a low cost and used for a substrate for an electronic circuit, and provide a manufacturing method of the same. ! A metal-ceramic compound substrate 10 comprises: a metal substrate 11; a ceramic layer 12 formed on the metal substrate 11; an electrode layer 13 formed on the ceramic layer 12; and a solder layer 14 formed on the electrode layer 13. The ceramic layer 12 comprises a ceramic thin film. The metal-ceramic compound substrate 10 with favorable heat dissipation properties is obtained by forming the ceramic layer 12 of an aluminum nitride thin film. ! (C)2007,JPO&INPIT |
发布日期：2007-07-19 08:37:00