| 专利名称： | Electrically conductive paste and multilayer ceramic substrate |
| 公开（告）号： | |
| 公开（公告）日： | 2007-04-12 00:00:00 |
| 申请（专利）号： | US20040576801(US2007080329) |
| 申请日： | 2004-11-10 00:00:00 |
| 发明（设计）人： | |
| (申请)专利权（人）： | NOMIYA MASATO (JP);URAKAWA JUN (JP) |
| 内容： | An electrically conductive paste used for forming wiring conductors, such as via holes ( 15 ) disposed on a multilayer ceramic substrate ( 11 ), is provided, wherein the temperature range, in which sintering is effected in a firing step, can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a grass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers ( 12 ) included in the multilayer ceramic substrate ( 11 ) in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150 DEG C. to 300 DEG C. lower than the above-described sintering temperature. |
发布日期：2007-08-27 10:01:00