首页>>国外专利>>Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means
| 专利名称： | Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means |
| 公开（告）号： | |
| 公开（公告）日： | 2006-07-27 00:00:00 |
| 申请（专利）号： | US20060544516,US2006164785 |
| 申请日： | |
| 发明（设计）人： | SEMCO ENGINEERING S A (FR) |
| (申请)专利权（人）： | PELLEGRIN YVON (FR) |
| 内容： | The invention concerns an electrostatic chuck ( 250 ) comprising an upper ceramic ( 205 ) bearing the substrate ( 200 ) to be treated and a lower ceramic ( 215 ) bearing heating elements ( 225 ) and radio frequency electrodes ( 220 ), said ceramics being permanently bonded together. Said ceramics are preferably bonded together by heated glass and the lower ceramic is fixedly assembled to a pedestal, for example through a soldered bonding. |
发布日期：2006-11-26 19:44:00