首页>>国外专利>>KILN, AND MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT USING THE KILN
| 专利名称： | KILN, AND MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT USING THE KILN |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-28 00:00:00 |
| 申请（专利）号： | JP2005171970(JP2006349196) |
| 申请日： | 2005-06-13 00:00:00 |
| 发明（设计）人： | MURATA MFG CO LTD |
| (申请)专利权（人）： | OGAWA KANTA |
| 内容： | To realize a kiln capable of suppressing dispersion of oxygen partial pressures in an interior, and to realize a manufacturing method of a laminated ceramic electronic component capable of suppressing dispersion of degrees of sintering between laminated ceramic electronic components by using the kiln. ! In the kiln arranged with a heat insulating material 2 on an internal wall surface 1, metal tabular members 4 are provided along an inner circumference of the internal wall surface 1 to protrude into the heat insulating material 2. The tabular members are formed along the entire circumference as seen from a projected view. The laminated ceramic electronic component is manufactured by using the kiln, and carrying out a baking process under a predetermined oxygen partial pressure. ! (C)2007,JPO&INPIT |
发布日期：2007-08-16 14:43:00