| 专利名称： | CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD AND POWER CONTROL COMPONENT USING SAME |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-28 00:00:00 |
| 申请（专利）号： | JP2005178876(JP2006351988) |
| 申请日： | 2005-06-20 00:00:00 |
| 发明（设计）人： | DENKI KAGAKU KOGYO KK |
| (申请)专利权（人）： | KADOTA KENJI ; IBUKIYAMA MASAHIRO |
| 内容： | To provide a ceramic substrate, ceramic circuit board, and power control component using the same in which a solder crack can be suppressed even if an inexpensive metallic heat radiating member (heat sink) of a high heat conduction rate and a high thermal expansion coefficient, representatively like a copper heat radiating member is used. ! In a ceramic substrate configured by bonding metal sheets 3 on both principal surfaces of a ceramic plate 1, a non-binding portion B which is not bound with the ceramic plate 1 is included on a surface of a metal sheet 3 on at least one principal surface opposite to the ceramic plate. When the thickness of the metal plate including the non-binding portion B is defined as (t) and a distance from the end of the metal sheet to a binding portion between the metal sheet 3 and the ceramic plate 1 is defined as L1, (L1/t) becomes 0.03 to 15. ! (C)2007,JPO&INPIT |
发布日期：2007-08-16 15:06:00