| 专利名称： | CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING IT |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-28 00:00:00 |
| 申请（专利）号： | JP2005176161(JP2006351834) |
| 申请日： | 05-06-16 00:00:00 |
| 发明（设计）人： | HITACHI METALS LTD |
| (申请)专利权（人）： | IMAMURA TOSHIYUKI ; TEJIMA HIROYUKI ; |
| 内容： | To provide a ceramic circuit board having an excellent heat-dissipating property and being not peeled, by using a technique determining the thermal behavior of the ceramic circuit board having a laminated structure composed of materials of a different kind, and to provide a semiconductor module. ! The ceramic circuit board 10 has a ceramic plate board 11 functioning as an insulating layer such as a silicon nitride board (the Si3N4 board) 11a, a metal plate 12 for forming a circuit pattern joined on one surface of the ceramic plate board 11 through a solder material, and the metal plate 13 for dissipating a heat joined on the other surface of the ceramic plate board 11 through the solder material. The metal plate for forming the circuit pattern and the metal plate for dissipating the heat are formed of Al or an Al alloy. The ceramic circuit board 11 having such a constitution is controlled so that an apparent coefficient of thermal expansion is kept within a range from 10 ppm/k to 17 ppm/k. ! (C)2007,JPO&INPIT |
发布日期：2007-08-16 15:05:00