| 专利名称： | Metal/ceramic circuit board |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-28 00:00:00 |
| 申请（专利）号： | DE20026012027T(DE60212027T) |
| 申请日： | 2002-09-25 00:00:00 |
| 发明（设计）人： | DOWA MINING CO (JP) |
| (申请)专利权（人）： | TSUKAGUCHI NOBUYOSHI (JP);KIMURA MASAMI (JP) |
| 内容： | There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness of 0.1 mm to 0.5 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 mu m. |
发布日期：2007-08-17 08:30:00