| 专利名称： | PROCESS FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT |
| 公开（告）号： | |
| 公开（公告）日： | 2007-01-18 00:00:00 |
| 申请（专利）号： | JP2005187695(JP2007013253) |
| 申请日： | 2005-06-28 00:00:00 |
| 发明（设计）人： | SANYO ELECTRIC CO LTD |
| (申请)专利权（人）： | HOSOKAWA JUNJI |
| 内容： | To prevent the occurrence of short-circuit failures, without causing increase in the size of a multilayer ceramic electronic component. ! The process for manufacturing a multilayer ceramic electronic component comprises a step for forming predetermined conductor pattern and vertical line on respective green sheets that serve as a plurality of ceramic layers 11-14, a step for forming a second vertical line 21 and a fourth conductor pattern 22 for electrically interconnecting a third conductor pattern 31 and a second conductor pattern 32 susceptible to short-circuit failure in subsequent calcination process and then laminating a plurality of green sheets thus obtained, and a step for cutting the fourth conductor pattern 22 following to a step for calcining a lamination thus obtained and insulating the third conductor pattern 31 and the second conductor pattern 32 from each other. ! (C)2007,JPO&INPIT |
发布日期：2007-08-21 10:28:00