| 专利名称： | Laser method for machining through holes in a ceramic green sheet |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-14 00:00:00 |
| 申请（专利）号： | DE20006030195T(DE60030195T) |
| 申请日： | 2000-03-30 00:00:00 |
| 发明（设计）人： | MURATA MANUFACTURING CO (JP) |
| (申请)专利权（人）： | YAMAMOTO TAKAHIRO (JP);KOMATSU HIROSHI (JP) |
| 内容： | A plurality of feedthrough holes are efficiently formed on the present invention by splitting a laser beam emitted from a laser source (1) into plural laser beams (2) by allowing the beam to pass through a diffraction grating (3), followed by simultaneously forming a plurality of the feedthrough holes on the ceramic green sheet (10) by irradiating the ceramic green sheet (10) with the split laser beam. |
发布日期：2007-08-17 08:37:00