| 专利名称： | Wiring board construction including embedded ceramic capacitors(s) |
| 公开（告）号： | |
| 公开（公告）日： | 2007-03-01 00:00:00 |
| 申请（专利）号： | US20060513249(US2007045815) |
| 申请日： | 2006-08-31 00:00:00 |
| 发明（设计）人： | |
| (申请)专利权（人）： | URASHIMA KAZUHIRO (JP);YURI SHINJI (JP) |
| 内容： | A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such that the core main surface and a capacitor main surface of each capacitor face the same way. The built-up layer includes semiconductor integrated circuit element mounting areas at various locations on a surface thereof. In the substrate core, each ceramic capacitor is respectively disposed in an area corresponding to each semiconductor integrated circuit element mounting area. |
发布日期：2007-08-23 15:52:00