| 专利名称： | Conductive composition and ceramic electronic component |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-28 00:00:00 |
| 申请（专利）号： | US20060510714 （US2006289840） |
| 申请日： | 2006-08-28 00:00:00 |
| 发明（设计）人： | TDK CORP (JP) |
| (申请)专利权（人）： | MIURA SHUICHI (JP) |
| 内容： | Disclosed is a conductive composition used for a conductor of an electronic component, comprising a metal particle and a metal oxide particle which has an average particle size of 5 to 60 nm, a melting point of 1500 DEG C. or higher, and a content of 0.1 to 10.0 wt % based on the amount of the metal particle. According to the conductive composition, even when the metal particle is made fine, a sintering initiation temperature can be adequately increased, thus a generation of a crack and a de-lamination can be prevented easily and firmly. |
发布日期：2007-07-13 10:47:00