| 专利名称： | Thermally conductive ceramic tipped contact thermocouple |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-07 00:00:00 |
| 申请（专利）号： | US20050143270（US2006275933） |
| 申请日： | 2005-06-02 00:00:00 |
| 发明（设计）人： | |
| (申请)专利权（人）： | DU BOIS DALE R (US） |
| 内容： | An apparatus for processing a substrate. The apparatus comprising a tubular member with a first end and a second end. The first end comprising an opening; and a temperature sensor disposed in the opening. The temperature sensor comprising a resilient member. The resilient member comprising a surface made of a ceramic material wherein the surface made of a ceramic material extends through the opening to provide a substrate contact surface. |
发布日期：2007-07-13 10:15:00