| 专利名称： | METAL-CERAMIC SUBSTRATE |
| 公开（告）号： | |
| 公开（公告）日： | 2007-03-21 00:00:00 |
| 申请（专利）号： | EP20050747680(EP1763495 ) |
| 申请日： | 2005-04-23 00:00:00 |
| 发明（设计）人： | CURAMIK ELECTRONICS GMBH (DE) |
| (申请)专利权（人）： | SCHULZ-HARDER JUERGEN (DE);EXEL KARL (DE) |
| 内容： | In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to the ceramic material by direct bonding or active soldering, the ceramic material comprises at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer. |
发布日期：2007-08-24 15:26:00