| 专利名称： | System and Method for Noise Reduction in Multi-Layer Ceramic Packages |
| 公开（告）号： | |
| 公开（公告）日： | 2007-04-12 00:00:00 |
| 申请（专利）号： | US20060538531(US2007080436) |
| 申请日： | 2006-10-04 00:00:00 |
| 发明（设计）人： | IBM |
| (申请)专利权（人）： | CHUN SUNGJUN (US);FRANKEL JASON L (US) |
| 内容： | A system and method for reducing noise in a multi-layer ceramic package are provided. With the system and method, additional shielding wires are inserted into the reference planes wherever there are no signal vias present. These additional lines in the reference planes force stronger signal interaction with the reference (vdd/gnd) thereby reducing the interaction between the signals in the signal layers. As a result, the noise present in the signals of the signal layers is reduced. |
发布日期：2007-08-27 09:59:00