| 专利名称： | Process for manufacturing a metal-ceramic substrate |
| 公开（告）号： | |
| 公开（公告）日： | 2007-04-19 00:00:00 |
| 申请（专利）号： | DE19995014232(DE59914232D) |
| 申请日： | 1999-05-28 00:00:00 |
| 发明（设计）人： | ELECTROVAC AG (AT) |
| (申请)专利权（人）： | |
| 内容： | A metal-ceramic substrate production process comprises laser machining a ceramic layer (2) in an oxygen-containing atmosphere to form a line of weakness after applying a structured metal layer (7). A metal-ceramic substrate is produced by: (a) providing a ceramic layer (2) with a first structured metal layer (7); (b) laser machining the ceramic layer in an atmosphere containing >= 30% oxygen to form a line of weakness in the form of a groove (6) and/or several adjacent holes or recesses; and (c) electrolessly depositing a second metal layer. Preferred Features: The first metal layer is a directly bonded or actively soldered foil or a thick film layer of copper (alloy) and the ceramic layer is an Al2O3, AlN, Si3N4 or SiC layer. |
发布日期：2007-08-27 10:56:00