| 专利名称： | CERAMIC CIRCUIT BOARD AND POWER CONTROL COMPONENT USING SAME |
| 公开（告）号： | |
| 公开（公告）日： | 2007-01-18 00:00:00 |
| 申请（专利）号： | JP2005194751(JP2007013028) |
| 申请日： | 2005-07-04 00:00:00 |
| 发明（设计）人： | DENKI KAGAKU KOGYO KK |
| (申请)专利权（人）： | FUKAZAWA MOTOHARU |
| 内容： | To provide a ceramic circuit board which has superior reliability when joined with lead-free solder, and a power control component using the same. ! The ceramic circuit board is formed by joining an aluminum circuit and a heat radiation aluminum plate to a ceramic substrate, and the heat radiation aluminum plate is made of two layers of aluminum plates differing in purity. Here, the purity of the heat radiation aluminum plate which is joined to the ceramic substrate is ≥99.5% by mass, and the purity of the heat radiation aluminum plate which is not joined to the ceramic substrate is <99.5% by mass. ! (C)2007,JPO&INPIT |
发布日期：2007-08-21 10:23:00