| 专利名称： | CURABLE SLURRY FOR FORMING CERAMIC MICROSTRUCTURE ON SUBSTRATE USING MOLD |
| 公开（告）号： | |
| 公开（公告）日： | 2007-01-25 00:00:00 |
| 申请（专利）号： | JP2006223434(JP2007015391) |
| 申请日： | 2006-08-18 00:00:00 |
| 发明（设计）人： | 3M CO |
| (申请)专利权（人）： | DILLON KENNETH R ; MOH KYUNG H ; WOOD THOMAS E |
| 内容： | To provide a method for forming a ceramic microstructure on a substrate using curable slurry. ! This method for forming the ceramic microstructure comprises: a step of preparing a mold having a microstructured surface; a step of filling slurry between the microstructured surface and the substrate surface so that the slurry substantially fills the microstructured surface of the mold; a step of solidifying the slurry by radiation curing, electron beam curing, thermal curing or cooling from molten state to form a green material adhering to the substrate, wherein the slurry comprises a ceramic powder, a binder and a diluent which phase separates from the binder when the binder solidifies; and a step of removing the mold. In an embodiment of the method, the component ratio of the diluent (c) to the fugitive binder (b) is ≥1:3, and the binder is selected from an acrylate and an epoxy resin, and preferably the binder is an acrylate. ! (C)2007,JPO&INPIT |
发布日期：2007-08-21 10:30:00