首页>>国外专利>>PLATING DEVICE, PLATING METHOD, AND METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT
| 专利名称： | PLATING DEVICE, PLATING METHOD, AND METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT |
| 公开（告）号： | |
| 公开（公告）日： | 2007-01-25 00:00:00 |
| 申请（专利）号： | JP2005200627(JP2007016290) |
| 申请日： | 2005-07-08 00:00:00 |
| 发明（设计）人： | MURATA MFG CO LTD |
| (申请)专利权（人）： | YASUDA ATSUSHI |
| 内容： | To prevent the flow out of articles to be plated from a plating vessel; and to form a desired plated film on the article to be plated in high-efficiency. ! This plating device has a plating bath 3 in which a plating liquid 1 is stored and a plating vessel 4 which has a cathode plate 8, accommodates many articles 16 to be plated, containing a magnetic material, and is immersed in the plating bath 3. In the vessel 4, an electromagnet is provided for attracting the articles 16 to be plated in the direction of the bottom surface 4a of the vessel 4. The vessel 4 in which many articles 16 to be plated are accommodated is immersed in the plating bath 3, and the articles 16 to be plated are attracted in the direction of the bottom surface 4a of the vessel 4 by energizing the electromagnet 5. Thereby, the articles 16 to be plated are immersed in the plating bath 3. Thereafter, energization of the electromagnet 5 is interrupted, and the articles 16 to be plated are agitated by rotating the plating vessel 4 in a horizontal direction and plating treatment is performed by applying a current between the cathode plate 8 and an anode rod 2. ! (C)2007,JPO&INPIT |
发布日期：2007-08-21 10:34:00