首页>>国外专利>>RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES
| 专利名称： | RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES |
| 公开（告）号： | |
| 公开（公告）日： | 2007-01-04 00:00:00 |
| 申请（专利）号： | DE19966036716(DE69636716D) |
| 申请日： | 1996-01-16 00:00:00 |
| 发明（设计）人： | MAXWELL TECHNOLOGIES INC (US) |
| (申请)专利权（人）： | STROBEL J (US);CZAJKOWSKI R (US) |
| 内容： | The radiation shielded and packaged integrated circuit semiconductor device (400) includes a lid (470) secured to a base (410) to enclose the integrated circuit die (480) within, wherein the lid (470) and the base (410) are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment (700) includes a die attach slug (790) constructed from a high-Z material disposed between the integrated circuit die (780) and a base (710), in combination with a high-Z material lid (770) to substantially block incident radiation. |
发布日期：2007-08-21 10:51:00