首页>>国外专利>>Wiring board with core board having a ceramic sub-core and method for manufacturing the same
| 专利名称： | Wiring board with core board having a ceramic sub-core and method for manufacturing the same |
| 公开（告）号： | |
| 公开（公告）日： | 2006-12-20 00:00:00 |
| 申请（专利）号： | EP20060012398(EP1734580) |
| 申请日： | 2006-06-16 00:00:00 |
| 发明（设计）人： | NGK SPARK PLUG CO (JP) |
| (申请)专利权（人）： | YURI SHINJI (JP);MURAMATSU MASAKI (JP) |
| 内容： | A wiring board 1 includes a plurality of via pads 31 disposed on a ceramic sub-core (3) accommodated in a core board. A Cu-plated layer is formed on the surface of a conductor pad 31 and serves as a processed face, i.e., a face to which Cu surface chemical processing is applied in order to improve the adhesion between the surface of the Cu-plated layer and that of an adjacent polymer material. The lowermost dielectric layer B11, B21 of a laminated wiring portion L1, L2, and a via conductor 6 formed in the dielectric layer, are in electrical contact with the processed face. |
发布日期：2007-08-17 14:41:00