专利名称: METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
公开(告)号:
公开(公告)日: 2006-12-14 00:00:00
申请(专利)号: WO2006JP310328(WO2006132087)
申请日: 2006-05-24 00:00:00
发明(设计)人: DOWA MINING CO (JP)OSHIKA YOSHIKAZU (JP)
(申请)专利权(人): OSHIKA YOSHIKAZU (JP)
内容: A metal-ceramic composite substrate having an excellent heat dissipating characteristic and a method for manufacturing such composite substrate at low cost. The metal-ceramic composite substrate (10) is composed of a metal substrate (11), a ceramic layer (12) formed on the metal substrate (11), an electrode layer (13) formed on the ceramic layer (12), and a solder layer (14) formed on the electrode layer (13). The ceramic layer (12) is composed of a ceramic thin film. When the ceramic layer (12) is formed of an aluminum nitride thin film, the metal-ceramic composite substrate (10) having the excellent heat dissipating characteristic is provided for an electronic circuit.

发布日期:2007-08-17 15:04:00

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