首页>>国外专利>>Ceramic structure, method for manufacturing ceramic structure, and nonreciprocal circuit device
| 专利名称： | Ceramic structure, method for manufacturing ceramic structure, and nonreciprocal circuit device |
| 公开（告）号： | |
| 公开（公告）日： | 2007-01-04 00:00:00 |
| 申请（专利）号： | US20060327856(US2007002521) |
| 申请日： | 2006-01-09 00:00:00 |
| 发明（设计）人： | |
| (申请)专利权（人）： | KIMURA MASAHIRO (JP) |
| 内容： | A method of forming a ceramic structure includes disposing substrate-forming ceramic green sheets having conductors, internal conductors, and via conductors so as to sandwich connecting member-forming ceramic green sheets having via conductors, followed by lamination and bonding thereof by pressure application, with the conductors being formed using a conductive paste primarily composed of a powdered metal, so that a ceramic laminate composed of ceramic molded bodies laminated to each other is formed. The ceramic laminate is fired at a temperature at which the substrate-forming ceramic green sheets are sintered and the connecting member-forming ceramic green sheets are not sintered and at a temperature not more than the melting point of the metal, and subsequently, the connecting member-forming ceramic green sheets are removed from the fired composite laminate, thereby forming a ceramic structure. |
发布日期：2007-08-20 16:42:00